|
|
October Edition - AVAILABLE NOW! |
Welcome to the latest issue of Future Fab International! We are pleased to introduce the newest member of the Future Fab Editorial Panel, helping to lead the Manufacturing Systems & Software section: Tom Sonderman, vice president, Manufacturing Systems Technology, AMD. And helping to spearhead our Future Visions & Current Concerns section is Luigi Columbo, Fellow at Texas Instruments. Beginning in this issue, Mr. Sonderman and Dr. Columbo shares their thoughts.
Below is a sample of what you will find in this issue – please sign up, log in, download and tell us what you think. If you like what we are doing with Future Fab – tell a friend – the more people visit, the more content we can give you. And don’t forget that we have almost 1,000 archived technical articles – that you can view for free!
Download Your Copy Now!
It's FREE and only takes a couple of minutes.
|
|
In this issue:
Future Visions & Current Concerns
How the foundry model will adapt to trend-driven changes in the market.
Browse the entire Table of Contents
Download the new issue now
New Technologies & Device Structures
Where nanotechnology has penetrated the semiconductor industry and where the potential growth opportunities lie.
Browse the entire Table of Contents
Download the new issue now
Design Implementation & Process Integration
A paper that describes why the selection of the right DFM solution will depend on the human factors of the players.
Why the semiconductor and surrounding industries should consider looking into possible hybrid engineering in the DFM area.
Browse the entire Table of Contents
Download the new issue now
Manufacturing, Systems & Software
A discussion of challenges and opportunities associated with manufacturing automation development for DFM.
Various factors that define the optimal quantity of wafers in a lot of size smaller than 25 wafers, and that shows the potential for decreases in cycle time associated with various equipment configurations and wafer lot sizes.
Browse the entire Table of Contents
Download the new issue now
Front End of Line
A discussion of one of many critical challenges in Ge-based channels—threshold voltage control—and an overview of module-level issues in non-planar devices.
A technique that involves the field-by-field deposition and exposure of a low viscosity resist deposited by jetting technology onto the substrate.
Browse the entire Table of Contents
Download the new issue now
Back End of Line
An investigation of the critical issue of mechanical stability in certain airgap interconnect structures during thermal processing and under chip packaging interaction (CPI) using 3D multilevel finite element analysis (FEA) models.
A paper that investigates the impact of CO2 plasma on porous organosilicate low-k dielectrics to explore its potential to replace O2 plasma for ashing processes.
Browse the entire Table of Contents
Download the new issue now
Metrology, Inspection & Failure Analysis
A work that challenges the premise that metrology is a nonvalue-added necessary evil, positing that it is a dangerous assertion that should be viewed as obsolete thinking.
A report on the measurement of the nitrogen content in a set of thin thermal oxides, comparing different noncontact electrical and XPS techniques.
Browse the entire Table of Contents
Download the new issue now
Wafer Fab & Packaging Integration
A study that proposes two approaches to improve the electroplating process for filling vias of 5 µm x 25 µm, both resulting in void-free CU electroplating of 3D vias with reduction in electrodeposition time.
An article that focuses on principle methods of 3D chip stacking; particularly, cost-effective and reliable thinning and singulation processes for semiconductor facilities.
Browse the entire Table of Contents
Download the new issue now
Assembly, Test & Packaging Technologies
Why the main challenges in electronic packaging for the years ahead are maintaining a workable industrial infrastructure for complex system solution packaging and developing cost-attractive manufacturing platforms for the strong proliferation of package solutions.
Browse the entire Table of Contents
Download the new issue now
A Novel Post-Pump PFC Abatement Technology Based on Atmospheric Surface-Wave Microwave Plasmas
An atmospheric surface-wave microwave plasma technology is presented as an alternative to classical combustion systems for post-pump abatement of etch process effluents containing perfluorinated compounds (PFCs).
Future Fab Intl.Volume 14, 2/11/2003
|
